GLEIF Golden Copy (Level 1)

ＮＥＸＴ　ＦＵＮＤＳ　Ｓ＆Ｐ　５００　半導体・半導体製造装置３５％キャップ指数連動型上場投信

ＮＥＸＴ　ＦＵＮＤＳ　Ｓ＆Ｐ　５００　半導体・半導体製造装置３５％キャップ指数連動型上場投信 is a legal entity registered in Japan. It has the Legal Entity Identifier (LEI) 3538003O5WZMS9H0UL10 and a registration status of active, and is based in 東京都 港区, Japan.

ACTIVE
Legal nameＮＥＸＴ　ＦＵＮＤＳ　Ｓ＆Ｐ　５００　半導体・半導体製造装置３５％キャップ指数連動型上場投信
Also known asThe Master Trust Bank of Japan, Ltd./T080534601
LEI3538003O5WZMS9H0UL10
CountryJapan (JP)
Legal jurisdictionJP
Legal form9999
Registration authorityRA000413
Registration IDT080534601
Registered address赤坂一丁目8番1号　赤坂インターシティAIR, 東京都 港区, 107-8472, Japan

Frequently asked questions

What is the LEI of ＮＥＸＴ　ＦＵＮＤＳ　Ｓ＆Ｐ　５００　半導体・半導体製造装置３５％キャップ指数連動型上場投信?

The Legal Entity Identifier (LEI) of ＮＥＸＴ　ＦＵＮＤＳ　Ｓ＆Ｐ　５００　半導体・半導体製造装置３５％キャップ指数連動型上場投信 is 3538003O5WZMS9H0UL10.

Where is ＮＥＸＴ　ＦＵＮＤＳ　Ｓ＆Ｐ　５００　半導体・半導体製造装置３５％キャップ指数連動型上場投信 registered?

ＮＥＸＴ　ＦＵＮＤＳ　Ｓ＆Ｐ　５００　半導体・半導体製造装置３５％キャップ指数連動型上場投信 is registered in Japan, in 東京都 港区.

Is ＮＥＸＴ　ＦＵＮＤＳ　Ｓ＆Ｐ　５００　半導体・半導体製造装置３５％キャップ指数連動型上場投信 active?

ＮＥＸＴ　ＦＵＮＤＳ　Ｓ＆Ｐ　５００　半導体・半導体製造装置３５％キャップ指数連動型上場投信 has a registration status of ACTIVE.

Registered at the same address

60+ other companies share this registered address (赤坂一丁目8番1号　赤坂インターシティAIR, 東京都 港区).

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Source & export

Source: GLEIF Golden Copy (Level 1) (CC0 1.0). Retrieved 2026-07-16. Last updated 2026-07-22.
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